FACILITIES

Process Equipment

Thin Film Deposition -

Sputtering System - Two D.C. Units and one R.F. Unit

E-Beam/Thermal Evaporation System

Oxidation Furnace -

High Temperature Oxidation/Diffusion Furnace

Photolithography -

Mask Aligner

Solvent Bench with the Spin Coater

Post Processing -

Wire Bonder

Lapping Machine

Characterization -

Potentiostat-Galvanostat

Impedance Analyzer

Probe Station